Job Title: Senior / Staff Engineer, PIC Packaging

Location: Cranbury, NJ

Division: Technology

Department: PIC Engineering

About Us

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security, as well as remote sensing applications.

Position Summary

We build the photonic hardware behind the next generation of quantum technologies — quantum computing, networking, and sensing. As the technical anchor for PIC packaging, you will own the assembly and reliability of our quantum PIC modules from concept through prototype and low-volume production: getting single photons and entangled states into and out of a chip with sub-micron precision, and building assemblies that hold performance through repeated thermal cycling. This is a hands-on, bench-and-lab role for someone who has spent a career solving the physical problems of optical packaging and wants to apply that craft to the low-loss, low-noise demands of quantum photonics.

Key Responsibilities

•    Own end-to-end packaging architecture for quantum PIC modules, from chip-on-carrier to final gold box hermetic assembly (thermal, mechanical, and optical co-design).

•    Develop and optimize fiber array unit (FAU) attachment — active/passive alignment, edge and grating coupling, UV-epoxy and laser-assisted bonding — for ultra-low insertion loss and stable, repeatable coupling.

•    Build assemblies for quantum photonic applications: single-photon / entangled-photon sources, quantum-network interfaces, and single-photon detector integration, where loss, back-reflection, and noise budgets are tight.

•    Integrate modulation and switching elements (including TFLN modulators) for state preparation, gating, and routing.

•    Define and qualify hermetic gold box packaging — lid sealing, fiber and electrical feedthroughs — and design submounts and heat-sinking that minimize CTE-mismatch stress.

•    Drive failure analysis and DOEs; transfer mature processes to technicians via procedures, fixtures, and training.

Required Qualifications

•    8+ years (Senior) / 12+ years (Staff) of hands-on optoelectronic, photonic, or optical-component packaging experience.

•    Deep expertise in fiber attachment and alignment — single-mode, PM (PANDA), and fiber-array — including developing new alignment methods and the equipment to execute them.

•    Working knowledge of PIC packaging: die attach, wire bonding, hermetic sealing, and low-loss optical coupling.

•    Solid thermal-mechanical design judgment: CTE matching, stress management, and joint integrity across wide thermal swings.

•    Experience with laser-based joining (YAG welding, laser soldering) and/or precision die and solder reflow.

•    Strong failure-analysis discipline and a track record of taking devices from prototype through qualification.

Preferred Qualifications

•    Cryogenic packaging experience — cold-finger / cold-plate thermal anchoring, cryostat fiber and electrical feedthroughs, operation at liquid-nitrogen (77 K) or liquid-helium (4 K) temperatures, and holding optical alignment through cooldown.

•    Packaging for quantum photonic applications (QKD, photonic quantum computing, SNSPDs, photon-pair sources).

•    High PER and ultra-low-loss results in PM and fiber-array assemblies.

•    Familiarity with TFLN / electro-optic platforms; high-speed RF interconnect a plus, not central.

•    Familiarity with hermeticity and reliability standards (Telcordia GR-468, MIL-STD leak testing).

•    Patents or publications reflecting original packaging contributions.

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990